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Views: 0 Author: Site Editor Publish Time: 2026-09-24 Origin: Site
The AI computing power cabinet is repeatedly down-clocked: copper cover plates and liquid cooling can only temporarily reduce the temperature. How to solve the problem of chip heat accumulation?
The cover assists heat dissipation, adapting to air-cooling and fixed heat conduction scenarios as needed. Aluminum material has fast heat exchange response and is suitable for air heat dissipation; copper material has strong heat storage capacity and is suitable for solid conduction and pulse high load scenarios. However, there is a physical upper limit to the thermal conductivity of the two (the thermal conductivity of copper is only 400W/(m·K)). In the face of high-power AI chips and computing power chips of more than 800W, concentrated hot spots cannot be quickly relieved. They can only even out the surface temperature and cannot solve the problem of heat accumulation inside the chip. At the same time, there is a large difference in thermal expansion coefficient between metal and silicon chips. Under long-term high and low temperature cycles, package warping and interface cracking are prone to occur, which accelerates device aging and failure.
The interior of the package relies on two layers of thermal interface materials, TIM I and TIM II, to eliminate the air gap on the contact surface and fill the thermal conduction gap. It is the core middle layer for heat dissipation in the package. Mainstream polymer TIM is doped with carbon, graphite, and ordinary metal fillers. Its overall thermal conductivity is weak and can only be adapted to low-power chips within 100W. Facing the current kilowatt-level high-power chips, the thermal resistance is too high, the heat conduction path is too long, and the heat dissipation efficiency is greatly reduced. Even if upgrading metal TIMs such as indium alloys can slightly reduce junction temperature and extend life, it still cannot solve the essential problems of insufficient thermal conductivity upper limit of materials, thermal expansion mismatch, and high-temperature delamination . The problem of thermal stress failure is particularly prominent in large-size packaging scenarios.
For space-constrained devices such as mobile phones and laptops, the industry adopts a two-phase heat exchange structure of heat pipes and vapor chambers to transfer chip heat to the edge of the device for heat dissipation, which can balance the surface temperature and expand the heat dissipation area. However, this solution is only for heat transfer , not real heat elimination, and cannot reduce the core junction temperature of the chip. Facing high-load GPUs and computing power chips, the heat dissipation capacity is seriously insufficient and can only barely maintain basic operation. Under high computing power conditions, frequency reduction and lag will inevitably occur, making it unable to adapt to high-density computing power scenarios.
Air cooling completely fails at 800-1200W power consumption. The industry has generally upgraded single-phase liquid cooling, two-phase boiling flow, complete machine immersion cooling and chip micro-channel heat dissipation technology. This type of solution can significantly increase the upper limit of system heat dissipation and is currently the mainstream choice for high-power chips in data centers. However, it is a system-level passive cooling and has two core shortcomings: First, it can only take away heat from the surface of the chip and the outside of the package, and cannot solve the problem of heat inside the chip package and stacked middle-layer bare chips. The core heat accumulation bottleneck and the problem of multi-layer interface thermal resistance superposition still exist; secondly, the equipment structure is complex, the modification cost is extremely high, and the operation and maintenance is difficult, and the liquid cooling cycle will aggravate the overall thermal stress of the package, long-term use may easily cause device failure, and it is impossible to take into account heat dissipation efficiency, stability and cost.
The industry improves the heat conduction path from the chip down to the PCB by upgrading gold-tin solder, sintered silver, and high thermal conductivity organic/ceramic substrates, optimizing the bump layout and grounding structure. However, this type of optimization is only local fine-tuning, and the improvement in thermal conductivity is limited. It cannot break through the physical ceiling of traditional materials. Moreover, high-end ceramic substrates and special solders are expensive, and the processing technology is complex. It cannot be implemented on a large scale, and it is difficult to eradicate the problem of hot spot accumulation under high heat flux density.
In view of the underlying shortcomings of traditional heat dissipation solutions, Debaishun relies on the mature MPCVD mass production process to create high-performance diamond heat sinks. With ultra-high thermal conductivity, ultra-low thermal expansion, high stability, and lightweight material properties, it reconstructs the heat dissipation path from the source of chip heat conduction, completely solving the pain points of traditional solutions that treat the symptoms but not the root cause, and becomes the ultimate solution for high-end chip heat dissipation.
The room temperature thermal conductivity of Debaishun diamond heat sink can reach 1500W/(m·K) , which is 5 times that of pure copper and 10 times that of silicon substrate, far exceeding all traditional metals, ceramics, and conventional TIM materials. Compared with traditional solutions that can only divert surface heat, diamond heat sinks can penetrate the package interface very quickly, shorten the core heat conduction path , quickly export concentrated hot spot heat in the active layer of the chip and the middle layer of the stack, eliminate heat accumulation inside the chip from the source, and completely solve the problem of excessive junction temperature and chip frequency reduction under high power and high computing power conditions, truly achieving 'active and efficient heat conduction' rather than passive cooling.
The thermal expansion coefficients of traditional copper-aluminum materials and silicon chips are greatly different, and hot and cold cycles are prone to delamination, warping, and cracking, which is the core cause of premature device failure. Debaishun diamond heat sink has an extremely low thermal expansion coefficient and is highly matched with silicon chips and silicon carbide power devices. It can greatly reduce the thermal stress on the packaging interface and eliminate the problems of material shedding, delamination and warping under high temperature conditions. It is perfectly suitable for 60×60mm, 8 Large-size advanced packages of 5×85mm or even 100×100mm, and the largest area can even reach 300×300mm, which greatly improves the chip’s service life and long-term operation stability, and solves the thermal adaptation shortcomings that cannot be avoided by traditional solutions.
Traditional heat dissipation relies on a complex combination of 'cover plate + multi-layer TIM + substrate + liquid cooling', which has many layers, serious thermal resistance superposition, and high operation and maintenance costs. Debaishun diamond heat sink can directly optimize the internal thermal link of the package, significantly reduce the interface thermal resistance , and can replace multi-layer conventional thermal interface materials and inefficient metal covers. With the same heat dissipation effect, there is no need to over-upgrade high-end systems such as liquid cooling and immersion systems, simplifying the heat dissipation structure, reducing equipment modification costs and operation and maintenance difficulties; at the same time, the material is light and thin, and extremely strong, adapting to the lightweight needs of computing centers, vehicles, aerospace and other scenarios.
Traditional heat dissipation solutions can only adapt to low- and medium-power chips, and are completely powerless when facing 1000W+ ultra-high-power AI GPUs, power semiconductors, 5G radio frequency chips, and laser chips. Debaishun diamond heat sinks rely on nanocrystal nucleation technology, with mature preparation technology and excellent product uniformity. They can be stably adapted to ultra-high power density scenarios, are resistant to high temperatures, aging, and radiation, and have no degradation in heat dissipation performance under long-term high-load operation. It can not only solve the heat dissipation bottleneck of current advanced packaging chips, but also proactively support the heat dissipation needs of 2nm and below advanced processes and multi-chip stacked components in the future, completely getting rid of the dilemma of "iterations cannot keep up with chip power consumption upgrades" of traditional solutions.
Traditional heat dissipation technology is a passive remedy, local alleviation, treating the symptoms but not the root cause . There are core problems such as low thermal conductivity limit, thermal stress imbalance, structural redundancy, and inability to cure hot spot heat accumulation; while Debaishun diamond heat sink is an innovation at the source, a breakthrough in materials, and a cure for heat dissipation problems . , through the core advantages of ultra-high thermal conductivity + thermal expansion adaptation + high stability, it opens up a full-dimensional heat dissipation path for the chip, taking into account heat dissipation efficiency, operational stability and overall cost, becoming a core material that replaces traditional heat dissipation solutions and adapts to the iteration of high-end semiconductor chips.
